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Conception et réalisation de capteurs de force, capteurs de couple , électronique de conditionnement

Stress Analysis - Strain gage bonding

Extensometry is related to the measurement of a strain on material by means of strain gage.

The measure of deformation of the strain gage (micromeasurement) is proportional to the variation of the resistance of this one and we can directly calculate the strain rate by relation with Young's Modulus.
CAPTRONIC provides bonding services for strain gages on materials, study, design, production of customized sensors : choice of strain gages for high temperature, fatigue life specimen, ...
Choice of strain gauges according to the environment of the specimen and the rate of use: the pattern, the dimension, the ohmic value, type of support, etc.
Commonly used adhesives: MM60, MM610, AE10, 450 from Vishay, EP150 from HBM,
 
Laboratory facilities : UPM 60 HBM with 60 measurement channels, 3 SPIDER 8 portable systems from HBM with temperature measurements and strain gauges, INSTRON 250KN machine ...

Stress measurement on electronic module with composite material support.

Equipment of a mechanical fatigue test specimen

Strain gauge installation - force sensor design with thermal compensation

Bonding of strain gauges on high pressure injector tube